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Thermal characteristics and fabrication of silicon sub-mount based LED package - ScienceDirect
Research status and prospects of deep ultraviolet devices
Through-Silicon via Submount for Flip-Chip LEDs
Application of micro/nano technology for thermal management of high power LED packaging – A review - ScienceDirect
LED output doesn't dwindle | Laser Focus World
Submounts and Subcarriers | Components for Fiber-Optic Communication Modules | Ceramic Packages | Products | KYOCERA
LED Substrates and Submounts | Cost Effective Ceramic Packaging
Thermal management of high-power LEDs - Wikipedia
US20130248913A1 - Highly reflective coating on led submount - Google Patents
aspects for effective Ultra High Brightness LED assembly | Download Scientific Diagram
Submount for high power LED 1-Submount for high power LED-Huabo(Suzhou) Thinfilm Technology Co.,ltd.
Schematic of a deep UV LED heterostructure flip-chip mounted onto a... | Download Scientific Diagram
ZEISS Microscopy Online Campus | Light-Emitting Diodes
Human-centric lighting placing greater demands on LED... Smart2.0
Examine the heated question of chip-scale packaging in the LED industry (MAGAZINE) | LEDs Magazine
Cross section of a flip-chip LED | Download Scientific Diagram
OSA | A novel integrated structure of thin film GaN LED with ultra-low thermal resistance
A) Submount with separated 1mm 2 flip-chip LEDs. The inset shows a... | Download Scientific Diagram
Techniques for Thermal Management in LED Lighting
Analysis of electrical parameters of InGaN-based LED packages with aging - ScienceDirect
About LED - Reno LED Lighting
Custom Packaging Solutions | Metallized Substrates, Packages & Components
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